Application of Automatic Dispenser in the Underfill Process

2021-08-05

The underfilling process is to apply epoxy glue to the edge of the flip chip. Through the "capillary effect", the glue is sucked to the opposite side of the component to complete the underfilling process, and then the glue is cured under heating.
Does the underfill process have any performance requirements for the dispenser?
1. The underfill must first heat the glue and maintain the temperature of the glue. Therefore, our dispenser equipment must have a thermal management function.
2. The underfill process needs to heat the components, which can speed up the capillary flow rate of the glue and provide a favorable guarantee for normal curing.
3. The underfilling process also requires high dispensing accuracy, especially when the RF shielding cover has been assembled in place, the dispensing operation needs to be performed through the upper hole.

In summary, the above is the performance requirements of the underfill process for the dispenser. We must pay special attention to the underfill process during the process of dispensing.

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